Yield & Defectivity Engineer

Description

This position will work with Process, Test, Quality, and Design groups to identify and solve yield problems in fast paced high volume environment manufacturing NFC (Near Field Communication) and analog printed integrated circuits (PICs) built on stainless steel foil. Additionally, this role will be responsible for finding, defining, and driving yield improvement projects focusing on finding and reducing sources of defects while scaling production to unprecedented volumes using roll to roll processing.

 

Responsibilities:

  • Provide support for entire unit when it comes to achieving yield and quality objectives through targeted defect density engineering
  • Determine priorities, concepts, and strategies regarding defect density improvements
  • Establish systems and procedures to prevent excursions and quickly identify issues
  • Collaborate with design engineering, process engineering and/or package engineering to correct the product defect or weakness and to improve the product reliability
  • Apply characterization and failure analysis procedures to identify the failure location and the root causes (troubleshooting capability)
  • Develop, run and analyze experiences to improve process
  • Identify potential for improvement relating to yield and quality in ongoing roll to roll production of NFC integrated circuits
  • Initiate, drive, and manage yield improvement projects

 

Requirements

Education and Experience:

  • Ideal candidate has BSEE or higher in a technical field such as Electrical Engineering, Materials Science or Physics with good knowledge of semiconductor device physics and fabrication principles, preferably in thin film transistors (TFTs)
  • 5+ years of hands-on process integration and yield improvement experience, preferably at a high-volume wafer fab
  • Experience in Design of experiments, statistical analysis, 8D problem solving and continuous improvement of defect and process performance
  • Knowledge of Statistical Process Control Methodologies
  • Failure analysis experience, particularly with Dual Beam FIB

 

Skills:

  • Ability to prioritize and execute on multiple projects simultaneously
  • Ability to summarize yield issues and communicate results to other groups
  • Good communication, presentation and teamwork skills are essential
  • Understanding of characterization and FA techniques
  • Proficient with MS Office, JMP, and SQL
  • Ability to successfully develop and present reports/presentations

 

To apply, please click here.